In the past deCADe, China's electronIC information industry has developed rapidly and the scale of the industry has been expanding. China has become the largest consumer electronics MARKet in the world, and the upstream and downstream industrial chains are fully equipped with PCB industrial demand. Mobile electronic products, such as SMArt phones, are still popular. The market for emerging consumer electronic products, such as wearable smart devices and unmanned aerial vehicles, is also rising rapidly. The trend of miniaturization and thinness of devices is becoming increasingly obvious. Traditional PCB can no longer meet the requirements of products. Therefore, major manufacturers have begun to research new technologies to replace PCB. FPC, as the most popular technology, is becoming the main connecting part of Electronic devices.

FPC into electronic market potential stocks

FPC is the fastest growing sub industry in PCB. FPC is a printed circuit board with high reliability and excellent flexibility, which is made of Flexible copper clad laminate. It is the base plate used for connecting electronIC parts, and also the medium of electronic product signal transmission.

As an important category of PCB, FPC has the advantages that other types of circuit boards cannot match, such as high wiring density, light weight, thin thickness, folding, bending resistance, high temperature resistance, 3D wiring, etc. It is more in line with the development trend of intelligent and portable electronic products in the downstream industry, and is bound to be widely used.

According to Prismark's prediction, the global FPC output value is expected to be close to 15.7 billion dollars by 2017, accounting for 23.9% of the entire PCB industry. Based on FPC's compliance with the general trend of PCB industry upgrading in the future, we expect that FPC industry is still expected to maintain a compound growth rate of 5-10% in the next five years, and continue to lead the PCB industry. The FPC market size should not be underestimated.

FPC has obvious advantages in the display module, touch module, fingerprint identification module, side key, power key and other modules of smart phones. About 14-16 FPCs were used in the new Apple mobile phone, which together with other PCB materials accounted for $15 in the cost. Huawei, OPPO, vivo and other doMEStic mobile phone manufacturers have also increased the use of FPC in high-end flagship machines, which is currently about 10-12 pieces, and is expected to continue to increase in the future under the trend of high-end.

Although the growth of the mobile phone market has slowed down, the share of domestic smart phones has continued to rise. HOV, Xiaomi and others have made collective breakthroughs. When Samsung's share has continued to decline and Apple's share has hit a bottleneck, they have bravely stood at the forefront. The rise of domestic mobile phone manufacturers is expected to bring explosive growth to FPC in the field of flexible phones.

With the rise of the global wearable market, large international electronic equipment manufacturers such as Google, Microsoft, Apple, Samsung and Sony have increased their investment in and research and development of wearable devices, and industry leaders such as Baidu, Tencent, Qihoo 360 and Xiaomi among domestic enterprises have also laid out wearable devices. FPC performance characteristics just meet the requirements of wearable devices and become the first choice of wearable devices. Therefore, the rapid development of wearable devices and other emerging terminal products will also make the FPC application field continue to expand.

FPC's unique characteristics meet a variety of R&D needs, which will determine the huge potential of the future FPC market.