Circuit board manufacturer: introduction to the basIC principle of BGA repair bench

BGA repair bench is a professional equipment used to repair BGA components, which is often used in the SMT industry. Next, we will introduce the basic principle of BGA repair bench, and analyze the key factors to improve the BGA repair rate. BGA repair bench can be divided into optical alignment repair bench and non optical alignment repair bench. Optical alignment refers to optical alignment during welding, which can ensure the accuracy of alignment during welding and improve the success rate of welding; Non optical alignment is performed through vision, and the accuracy of welding is not so good.

BGA repair bench is a professional equipment used to repair BGA components, which is often used in the SMT industry. Next, we will introduce the basic principle of BGA repair bench, and analyze the key factors to improve the BGA repair rate.

BGA repair bench can be divided into optical alignment repair bench and non optical alignment repair bench. Optical alignment refers to optical alignment during welding, which can ensure the accuracy of alignment during welding and improve the success rate of welding; Non optical alignment is performed through vision, and the accuracy of welding is not so good.

At present, the mainstream heating methods of BGA repair bench abroad include full infrared, full hot air and two hot air and one infrared. Different heating methods have different advantages and disadvantages. The standard heating method of BGA repair bench in China is generally the upper and lower hot air and the bottom infrared preheating, referred to as three temperature zone. The upper and lower heating heads are heated by the heating wire and the hot air is exported through the air flow. The bottom preheating can be divided into dark infrared heating tube, infrared heating plate and infrared light wave heating plate.

1. Upper and lower heating air head

Through the heating of the heating wire, the hot air is transmitted to the BGA components through the air nozzle to achieve the purpose of heating the BGA components, and through the opposite blowing of the upper and lower hot air, the PCB can be prevented from deformation due to uneven heating. Some people want to replace this part with hot air gun and air nozzle. I suggest not to do so, because the temperature of BGA repair bench can be adjusted according to the set temperature curve. It is not easy to control the welding temperature with hot air gun, thus reducing the success rate of welding.

2. Bottom infrared heating

Infrared heating is mainly used to preheat, remove the moisture inside the PCB and BGA, effectively reduce the temperature difference between the heating center and the surrounding, and reduce the probability of PCB deformation.

3. Supports and clamps of BGA repair bench

This part mainly supports and fixes the circuit board and plays an important role in preventing board deformation.

4. Temperature control

When disassembling and welding BGA, there is an important requirement for temperature. If the temperature is too high, BGA components are easy to burn. Therefore, the repair bench generally uses PLC control and full computer control instead of instrument control, which can be used for real-time temperature control.

When BGA is repaired through BGA repair bench, the main tasks are to control the heating temperature and prevent PCB deformation. Only by doing these two parts well, can the success rate of BGA repair be improved.

PCB manufacturers, PCB designers and PCBA processors will explain the basic principles of BGA repair bench.