We can Draw PCB well. Why can't we draw IC well? Why

PCB manufacturers, PCB designers and PCBA manufacturers explain to you that we can draw PCB well. Why can't we draw IC well? Why

In the eyes of non industry insiders, circuit manufacturing and IC manufacturing are basically the same thing, and there is little difference. When talking with friends in other industries, we do not know the difference between component manufacturing and PCB manufacturing.

However, from the perspective of industry insiders, these two industries are fundamentally different.

IC design and manufacturing: It is to place a large number of integrated circuits formed by micro electronIC components (transistors, resistors, capacitors, etc.) on a plastic substrate to make a chip. IC chips include wafer chips and packaging chips, and the corresponding IC chip production line consists of wafer production line and packaging production line.

PCB design and manufacturing: a large number of packaged chips, capacitors, resistors and other discrete components are connected together through PCB to form a macro circuit with complex and complete functions.

The relationship between the two is that wafer design ->wafer manufacturing ->chip packaging ->PCB design ->board level packaging ->system level software code final test

That is to say, the leading companies of mobile phones and computers are all doing board level packaging. Most of them can draw six or even eight layers of circuit boards, and various impedance antennas and RF signal lines are excellent. However, it is difficult to move forward. The main thing that can do chip sealing and testing is to buy equipment and test programs to earn processing costs, while there are not many independently designed machines.

From the perspective of wafer manufacturing and design, doMEStic wafer manufacturing is still at the low and middle end level, so there are a few large manufacturers that can take the lead in design.

Why is IC design so difficult?

In fact, after careful analysis of this problem, it is found that IC design is not difficult, it is complex, and the complexity is high to the extent that quantitative change causes qualitative change.

With the increasing functions of integrated circuits, the complexity of IC design is also increasing, and the related materials and processes are more and more sophisticated. I think the most obvious thing is that the division of labor in IC design is becoming more and more detaiLED.

Moreover, a chip design covers too many disciplines, not only to meet the design logic and algorithm feasibility, but also to have the underlying circuit logic verification, and also to consider manufacturing issues. It is easy to give up halfway without patience and the SPIrit of inquiry.

And there is a very famous law in the IC industry. You have to make mistakes to make progress in the next generation of products. Throughout the major CPU or MCU and other logic chips, there is no generation of versions that optimize power consumption, performance, structure and other aspects. The experience gained by each generation of optimization is a valuable asset for the next generation to avoid pitfalls.

In this case, our country started late. Although we are trying to catch up, some pits must be crossed. In fact, there are no corners to overtake. Some corners must be taken. What you need to do is to walk fast and steadily.

IC design and manufacturing is not very difficult. What is needed is details and an impetuous mind, which carries forward the rejuvenation dream.

PCB manufacturers, PCB designers and PCBA manufacturers explain to you that we can draw PCB well. Why can't we draw IC well? Why.